SMTA鑿澅楂樼鎶€鏈冭—iNEMI浣庢韩鐒婃帴鎶€琛撳伐浣滃潑
 
4鏈�24鏃ワ紝涓婃捣涓栧崥灞曡椁� 9铏熸渻璀板
 
         宸ユキ鐣屾鍦ㄥ槜瑭︽帰绱㈤噰鐢ㄤ綆婧剨鏂欑祫瑁濇墜姗熴€佸钩鏉块浕鑵﹀拰绉诲嫊闆昏叇绛夋秷璨婚浕瀛愮敘鍝併€傚皣閷妧閵咃紙SAC锛夌剨鑶忕殑宄板€煎洖娴佹韩搴﹀緸鐣跺墠240鈩冧互涓婄殑姘村钩闄嶄綆锛岀敱姝ゅ付渚嗙稉婵熸€с€佺挵澧冨拰鎶€琛撲笂鐨勫劒鍕€€備綆婧剨鎺ラ倓鐐烘柊鑸堝競鍫村瓒呯Щ鍕曡▓绠椼€佸彲绌挎埓瑷倷鍜岀墿鑱恫锛圛OT锛夋彁渚涗簡涓€绋經鍦ㄧ殑瑙ｆ焙鏂规锛屼互娓涘皯鏇村皬銆佹洿钖勫拰楂樺害闆嗘垚鐨勯浕瀛愯ō鍌欑殑绲勮涓殑鍕曟厠缈规洸銆傚皣鍥炴祦宄板€兼韩搴﹂檷浣庡埌200鈩冧互涓嬪彲浠ラ檷浣庤兘鑰楋紝鎻愰珮琛ㄩ潰璨艰鑹巼锛屼絾鍚屾檪涔熼渶瑕佹柊鐨勭剨鎺ユ潗鏂欏叿鍌欒壇濂界殑鍙潬鎬у拰宸ヨ棟鎬с€�
 
iNEMI鎶€琛撳伐浣滃潑榧撳嫷鑸囨渻鑰呭湪鐮旇◣涓簰鍕曪紝瑷庤珫鍜屽垎浜湁闂滀綆婧剨鏂欑殑淇℃伅鍜岀稉椹楋紝渚嬪锛�              
· 浣庢韩鐒婃枡鏉愭枡鍜屾妧琛撶殑鏂扮櫦灞曞拰鏈締瑷堝妰
· iNEMI鍩轰簬閷墠鐨勪綆婧剨鎺ュ伐钘濆拰鍙潬鎬ч爡鐩牨鍛�
· 鎻愰珮鐢㈤噺鍜岃唱閲忔墍闇€鐨勭爺绌跺壍鏂�
· 鏈締鐢㈠搧鍜屾妧琛撶殑瑕佹眰灏嶇剨閷潗鏂欏拰宸ヨ棟鐨勫奖闊�
· 浣庢韩鐒婇尗鏉愭枡鐨勫伐钘濇€с€佸彲闈犳€у拰澶辨晥鍒嗘瀽
· 瑷庤珫鏂扮殑鍚堜綔闋呯洰姗熸渻锛屾帹鍕曚綆婧剨閷妧琛撳湪琛屾キ涓殑闁嬬櫦鍜岄儴缃�
 
         鏈灏堥爡鐮旇◣鏈冪殑鐩浜虹兢鏄嚧鍔涗簬闁嬬櫦鍜岄憭瀹氭柊鍨嬩綆婧剨鏂欒В姹烘柟妗堢殑闆诲瓙鍒堕€犲晢銆佺爺绌朵汉鍝″拰渚涙噳鍟嗭紝鎮ㄥ皣鏈夋鏈冨拰浠栧€戞渻闈㈠苟鍒嗕韩鍜岃◣璜栥€�
 
璀扮▼瑷堝妰

鏅傞枔	璀伴	婕旇瑳鍢夎硴
9:30 – 9:45	绨藉埌
9:45 – 10:00	姝¤繋鍙婄爺瑷庢渻绨′粙	鍌呮旦鍗氬＋锛宨NEMI鍦嬮殯闆诲瓙鐢熺敘鍟嗚伅鐩�
10:00 – 10:30	浣跨敤浣庢韩鐒婃帴鐨勮〃闈㈣布瑁濇妧琛�	Kok Kwan Tang锛孋PTD 鎶€琛撻爡鐩稉鐞嗭紝 Intel鑻辩壒鐖�
10:30 – 10:55	闆诲瓙灏佽涓殑浣庢韩鐒婃帴鍚堥噾绯荤当	娌堥Э鏁欐巿锛屽崥灏庯紝 閲嶆叾澶у
10:55 – 11:20	iNEMI鍩轰簬閷墠鐨勪綆婧剨鎺ュ伐钘濆拰鍙潬鎬ч爡鐩牨鍛�, 鍌呮旦鍗氬＋, 浜炲お鍗€鍙婇爡鐩鐞嗙附鐩�, iNEMI鍦嬮殯闆诲瓙鐢熺敘鍟嗚伅鐩�
11:20 – 11:45	椤岀洰寰呭畾	鎴寸埦
11:45 – 13:00	鍗堥
13:00 – 13:25	鏂颁竴浠MT浣庢韩鐒婃帴鏉愭枡鐨勯枊鐧�	Naoki Kubota锛屾妧琛撻姺鍞皥鍝★紝鐢版潙闆诲瓙
13:25 – 13:50	鐢ㄤ簬SMT鐨勪綆婧剨鎺�”	Domini Zhang锛岄亱鐕熷伐绋嬬稉鐞嗭紝鍋夊壍鍔�
13:50 – 14:15	鍏堥€茬殑琛ㄩ潰璨艰鐒￠墰浣庢韩鐒婃帴鏉愭枡	Watson Tseng锛岀爺鐧煎壇绺借锛岀編鍦嬬附缍撶悊锛屾槆璨跨鎶€
14:15 – 14:30	鑼舵瓏
14:30 – 14:55	鐢ㄤ簬涓嬩竴浠ｈ閰嶇殑楂樺彲闈犱綆婧剨鎺ュ悎閲�	Annie Yang锛屼腑鍦嬪崁甯傚牬缍撶悊锛岄亥寰风編鎰涙硶
14:55 – 15:20	闆诲瓙瑁濋厤涓殑浣庢韩鐒婃帴鎶€琛� — 灏嶈閰嶅拰鍙潬鎬х殑鎸戞埌	灏氭攢鑸夊崥澹紝璩囨繁宸ョ▼甯紝鑿偤
15:20 – 15:45	鍎LTS瑙ｆ焙鏂规鍜屾噳鐢ㄥ韪� — NWO鐨勮В姹鸿垏LTS娣峰悎鐒婇粸瑭曞児鏂版柟娉�	闄虫锛岀爺鐧肩稉鐞嗭紝铇囧窞鍎
15:45 – 16:00	鑼舵瓏
16:00 – 16:20	搴ц珖灏堝绨″牨
16:20 – 17:00	搴ц珖鍟忕瓟
17:00 – 17:15	绺界祼

 
 
鍫卞悕娉ㄥ唺              
 鏃╅偿绁紙3鏈�31鏃ュ墠锛夛細760鍏冧汉姘戝梗锛�
甯歌绁紙3鏈�31鑷�4鏈�18鏃ュ墠锛夛細 900鍏冧汉姘戝梗
*鐧昏璨诲寘鎷渻璀板牨鍛婄殑鏉愭枡銆佸崍椁愬埜銆佸挅鍟�/鑼跺拰姘淬€�              
 
浜烘皯骞ｏ紙鏀粯锛夛細
璩埗鍚嶏細 婢抽緧淇℃伅绉戞妧锛堜笂娴凤級鏈夐檺鍏徃
璩櫉锛�   310066865018010020955
鏀舵琛岋細 浜ら€氶妧琛屼笂娴峰競鍒嗚寮垫睙鏀
 
闁嬬エ浜嬪疁璜嬭伅绯伙細sammulw@infosalons.com.cn 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
iNEMI Low-Temperature Solder Workshop – SMTA China East Conference
 
Join iNEMI at NEPCON China in Shanghai to discuss new developments and future plans for low-temperature solder materials and techniques.
 
iNEMI Low-Temperature Soldering Workshop
Held at 2019 SMTA China East Conference
Shanghai World Expo Exhibition and Convention Center
Wednesday, April 24 / 9:00-16:45 / Meeting room #9
 
Industry is exploring the adoption of low-temperature solder for the assembly of consumer electronic products, such as cell phones, tablets and mobile computers. Lowering peak reflow temperature from the current 240oC+ level for SnAgCu (SAC) solder paste has economic, environmental and technical benefits. Low-temperature soldering also provides a potential solution for reducing dynamic warpage in the assembly of smaller, thinner and highly integrated electronic packages for emerging markets such as ultra-mobile computing, wearable devices and Internet of Things (IoT). Lowering the reflow temperature below 200oC can reduce energy consumption and improve surface mount yields, but it also requires a new class of reliable soldering materials and processes.
 
This iNEMI workshop will provide an interactive forum where participants can discuss and share information about low-temperature solder such as:
· New developments and future plans for low-temperature solder materials and techniques
· Results from iNEMI’s BiSn-Based Low-Temperature Soldering Process and Reliability project
· Innovations required to improve yield and quality
· Impact of future product and technology requirements on solder materials and processes
· Processability, reliability and failure mechanisms of low-temperature solder materials
· Collaborative project opportunities to streamline low-temperature solder technology development and deployment in the industry
This workshop gives you the opportunity to meet and network with leading electronics manufacturers, researchers and suppliers who are working to develop and qualify new low-temperature solder solutions.
 
Registration
Early bird registration is USD$100 (CNY 760) until March 31, after which the fee is $120 (CNY 900). The registration fee covers workshop presentations, lunch coupon, coffee/tea breaks and water.
Click here for additional details, including agenda and registration.
https://community.inemi.org/ev_calendar_day.asp?date=4/24/2019&eventid=257 
Preliminary Agenda

Time		Topic	Speaker
9:30 – 9:45		Sign for workshop attendance
9:45 – 10:00		Welcome and Workshop Overview	Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI
10:00 –10:30		Surface Mount Technology Using Low Temperature Soldering	Kok Kwan Tang, CPTD Technical Program Manager, Intel
10:30 –10:55		Low Temperature Solder Alloy System in Electronic Packaging	Dr. Jun Shen, Professor, PhD Advisor, Chongqing University
10:55 –11:20		iNEMI BiSn-Based Low-Temperature Soldering Process and Reliability Project Report	Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI
11:20 –11:45		Presentation title & speaker TBC	Dell
11:45 –13:00		Lunch
13:00 –13:25		Development of Low Temperature Solder for Next Generation SMT	Naoki Kubota, Technical Sales Specialist, Tamura
13:25 –13:50		Low Temperature Solder for SMT	Domini Zhang, Operations Engineering Manager, Flex
13:50 –14:15		Advanced Low Temp Lead-free Solder for SMT Assembly	Watson Tseng, Vice President of R&D and General Manager of America, Shenmao Technology
14:15 –14:30		Tea break
14:30 –14:55		High Reliability Low Temperature Soldering Alloys for Next Generation Assemblies	Annie Yang, Regional Marketing Manager – China, MacDermid Alpha
14:55 –15:20		Application of Low Temperature Soldering Technology in Electronic Assembly—Assembly and Reliability Challenges	Dr. Panju Shang, Senior Engineer, Huawei
15:20 –15:45		Solution and Application Practice of Eunow’s LTS paste — NWO Solution and new method of LTS Mixed Solder Joint Evaluation	Qin Chen, R&D Manager, Eunow
15:45 –16:00		Tea break
16:00 –16:20		Presentation from panel list
16:20 –17:00		Panel discussion
17:00 –17:15		Wrap up